Radiation detectors and methods of fabricating radiation detectors

ABSTRACT

Radiation detectors and methods of fabricating radiation detectors are provided. One method includes mechanically polishing at least a first surface of a semiconductor wafer using a polishing sequence including a plurality of polishing steps. The method also includes growing a passivation oxide layer on a top of the polished first surface and depositing patterned metal contacts on a top of the passivation oxide layer. The method further includes applying a protecting layer on the patterned deposited metal contacts, etching a second surface of the semiconductor and applying a monolithic cathode electrode on the etched second surface of the semiconductor. The method additionally includes removing the protecting layer from the patterned metal contacts on the first surface, wherein the patterned metal contacts are formed from one of (i) reactive metals and (ii) stiff-rigid metals for producing inter-band energy-levels in the passivation oxide layer.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a Continuation-In-Part, and claims priority to andthe benefit of the filing date of U.S. Parent application Ser. No.13/302,835 filed on Nov. 22, 2011, the subject matter of which is hereinincorporated by reference in its entirety.

BACKGROUND OF THE INVENTION

The subject matter disclosed herein relates generally to radiationdetectors and more specifically to radiation detectors for medicalimaging, such as Nuclear Imaging (NI), Single Photon Emission ComputedTomography (SPECT), Positron Emission Tomography (PET) and ComputedTomography (CT).

Room temperature pixelated radiation detectors made of semiconductors,such as Cadmium Zinc Telluride (CdZnTe or CZT) semiconductors, haveentered into the commercial phase in medical imaging. In this commercialphase, it is desirable for these detectors to exhibit high performance,especially with respect to energy resolution and sensitivity. Inaddition, these detectors, which are often the core technologyintegrated into camera heads of systems such as SPECT, PET and CT,should be stable, reliable and produced with high yield to reduce cost.

The radiation semiconductor detectors generally include two surfaces,one having a cathode monolithic electrical-contact applied thereto andanother having surface pixelated anodes electrical contacts appliedthereto. Prior to the application of the electrical contacts, the firstand the second surfaces are etched by chemical wet etching. In CZTradiation detectors, the wet etching is done for at least tworeasons: 1) to remove the mechanical damage from the surfaces introducedin previous fabrication steps where the semiconductor wafers of thedetectors have been sliced and polished and 2) to create surfaces, whichare tellurium rich, which is used to produce Ohmic contacts such asIndium contacts applied to CZT wafers.

The tellurium rich first surface on which the anodes contacts areapplied have gap regions between the anodes contacts. The excesstellurium in the regions between the anodes causes these gaps to be of arelatively low surface resistance, which is also instable. Theinstability results in a reduction in the detector performances such asenergy resolution and sensitivity, fabrication with relatively lowproduction yield resulting in high cost detectors and unstable detectorswith reduced reliability having quality degradation over time.

BRIEF DESCRIPTION OF THE INVENTION

In one embodiment, a method for fabricating a radiation detector isprovided. The method includes mechanically polishing at least a firstsurface of a semiconductor wafer using a polishing sequence including aplurality of polishing steps, wherein a last polishing step of thepolishing sequence includes polishing with a slurry having a grain sizesmaller than about 0.1 μm to create a polished first surface. The methodalso includes growing a passivation oxide layer on a top of the polishedfirst surface to seal and passivate the polished first surface anddepositing patterned metal contacts on a top of the passivation oxidelayer having at least one pattern being (i) a pattern of pixelatedanodes or (ii) a pattern of pixelated anodes with grid electrodes havinglines of electrodes aligned along centers of gaps between the anodes.The method further includes applying a protecting layer on the patterneddeposited metal contacts to protect the metal pattern on the firstsurface, etching a second surface of the semiconductor and applying amonolithic cathode electrode on the etched second surface of thesemiconductor. The method additionally includes removing the protectinglayer from the patterned metal contacts on the first surface, whereinthe patterned metal contacts are formed from one of (i) reactive metalsand (ii) stiff-rigid metals for producing inter-band energy-levels inthe passivation oxide layer.

In another embodiment, a method for fabricating an anode side of aradiation detector. The method includes mechanically polishing at leasta first surface of a semiconductor wafer using a plurality of polishingsteps, growing a passivation oxide layer on a top of the polished firstsurface and forming patterned metal contacts on a top of the of thepassivation oxide layer using a dry process without wet chemicaletching.

In a further embodiment, a radiation detector is provided that includesa semiconductor, a passivation layer on a first surface of thesemiconductor and pixelated anode electrodes on the passivation layer.The radiation detector further includes rectifying anodes producinginter-band energy-levels in the passivation layer and a monolithiccathode of a second surface of the semiconductor opposite the firstsurface.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic illustration of a radiation detector fabricated inaccordance with various embodiments.

FIG. 2 is a diagram schematically illustrating the distribution ofelectrical-field lines in biased radiation detectors when gaps regionsbetween the anodes are produced with wet chemical etching.

FIG. 3 is a diagram schematically illustrating the distribution ofelectrical-field lines in biased radiation detectors when the gapsregions between the anodes are produced without wet chemical etching inaccordance with various embodiments.

FIGS. 4-12 are diagrams illustrating the fabrication steps involved inthe production of radiation detectors according to various embodiments.

FIG. 13 is a flow chart of a method for fabricating radiation detectorsin accordance with various embodiments.

FIGS. 14-20 are diagrams illustrating the fabrication steps involved inthe production of radiation detectors according to other variousembodiments.

FIGS. 21-23 are graphs illustrating energy bands in accordance withvarious embodiments.

FIG. 24 is a graph of a current-voltage curve in accordance with variousembodiments.

FIG. 25 is a graph of a resistance curve in accordance with variousembodiments.

FIG. 26 is a schematic illustration of a radiation detector formed inaccordance with other various embodiments.

FIG. 27 is a diagram illustrating a radiation detector form inaccordance with various embodiments.

FIG. 28 is a diagram of an electrical equivalent circuit for variousembodiments.

FIG. 29 is another graph of a current-voltage curve in accordance withvarious embodiments.

FIG. 30 is another graph of a resistance curve in accordance withvarious embodiments.

FIG. 31 is a flow chart of a method for fabricating radiation detectorsin accordance with other various embodiments.

DETAILED DESCRIPTION OF THE INVENTION

The following detailed description of certain embodiments will be betterunderstood when read in conjunction with the appended drawings. To theextent that the figures illustrate diagrams of the blocks of variousembodiments, the blocks are not necessarily indicative of the divisionbetween hardware or components. Thus, for example, one or more of theblocks may be implemented in a single piece of hardware or component ormultiple pieces of hardware or components. It should be understood thatthe various embodiments are not limited to the arrangements andinstrumentality shown in the drawings.

As used herein, an element or step recited in the singular and proceededwith the word “a” or “an” should be understood as not excluding pluralof said elements or steps, unless such exclusion is explicitly stated.Furthermore, references to “one embodiment” are not intended to beinterpreted as excluding the existence of additional embodiments thatalso incorporate the recited features. Moreover, unless explicitlystated to the contrary, embodiments “comprising” or “having” an elementor a plurality of elements having a particular property may includeadditional such elements not having that property.

Described herein are various embodiments for fabricating a radiationdetector. By practicing at least one embodiment, higher qualityradiation detectors having improved energy resolution and sensitivitymay be provided. By practicing at least some embodiments an improvedreliable process for fabricating radiation detectors may be providedhaving increased production yield that reduces the detector cost.

The radiation detectors of various embodiments are generally formedwherein a first surface that includes pixelated anodes is partiallyetched by chemical wet etching and in which the first surface of theradiation detector includes pixelated anodes under which the firstsurface is etched by chemical etching, wherein gaps between thepixelated anodes on the first surface are not etched by chemical wetetching. In various other embodiments, radiation detectors may befabricated in which the first surface of the radiation detector includespixelated anodes under which the first surface is etched by chemicaletching and the gaps between the pixelated anodes on the first surfaceare gently polished mechanically to maintain a stoichiometric structureof the semiconductor material in these regions. Moreover, the gapregions between the anodes may be encapsulated by a protective layer toprovide longer term stability of the detectors. The first surface of theradiation detector that includes pixelated anodes also may be fabricatedusing, for example, photolithography techniques including liftoff asdescribed in more detail herein.

Additionally, in various embodiments, the first surface of the radiationdetector includes pixelated anodes fabricated on regions in the firstsurface etched by chemical wet etching to improve electrical contact andto create undercut regions under the encapsulation layer. In variousembodiments, an efficient and reliable liftoff process for improvingproduction yield may result. In some embodiments, the fabricationprocess may be simplified by simultaneously etching the first and thesecond surface of the detectors wherein the first surface is etchedpartially only in the regions where the anodes are applied on thefollowing fabrication step. Thus, various embodiments provide aselective etching process that can yield increased production yield, forexample, an improvement of 40% in some embodiments relative to astandard process that includes complete wet etching of the anodessurface.

In other various embodiments, completely dry fabrication processes andmethods are provided, such as to fabricate radiation detectors. Thesemethods may provide additional productions yields, for example, in someembodiments, an improvement of 15%. In these embodiments, a pixelatedsemiconductor radiation-detector may be produced, wherein the surfaceside of the anodes is mechanically polished by a non-standard mechanicalpolishing process including multiple steps. At least one of stepsincludes using a slurry having non-standard grain-sizes of less than 0.1μm. By practicing these embodiments, a substantially damage free surfacesuitable for the application of anodes contacts thereon may be provided.Additionally, a substantially stoichiometric surface suitable for theapplication of anodes contacts thereon also may be provided. In someembodiments, the stoichiometric surface has no access to one of thecomponents of the semiconductor material, from which the surface ismade, to reduce or prevent oxidation of this surface to provide highsurface resistivity and detector performances that do not degrade withtime.

It should be noted that radiation detectors formed in accordance withvarious embodiments may be used, for example, in imaging systems toreconstruct or render an image. However, the term “reconstructing” or“rendering” an image or data set is not intended to exclude embodimentsin which data representing an image is generated, but a viewable imageis not. Therefore, when used, “image” broadly refers to both viewableimages and data representing a viewable image that may be generated fromdata acquired by a radiation detector of one or more embodiments. One ormore radiation detectors formed in accordance with various embodimentsmay be used to image an object, such as a human individual, anotherliving creature besides a human individual, or inanimate objects, suchas, but not limited to, luggage, shipping containers, and/or the like.However, in other embodiments, no image is generated or formatted andother data is acquired by the radiation detectors, such as spectralresponse data.

FIG. 1 is a schematic illustration of a perspective view of a radiationdetector 40 designed and fabricated according to various embodiments.The detector 40 is formed from a semiconductor 14 (e.g., a semiconductormaterial) that may be, for example, a Cadmium Zinc Telluride (CdZnTe orCZT) semiconductor. The semiconductor 14 includes a first surface 12 onwhich pixelated anodes 32 are formed and a second surface 10 on which amonolithic cathode 30 is formed. An encapsulation or passivation layer20 having openings 34, in which anodes 32 are formed, is deposited ontop of the first surface 12. The layer 20 may be made, for example, ofZinc Sulfide (ZnS). Additionally, gaps 16 are formed, which are thespaces under the encapsulation layer 20 between the anodes 32.

Surfaces 36 of the semiconductor 14 under the anodes 32 are chemicallyetched via openings 34 in the layer 20, which can improve the quality ofthe electrical contact of the anodes 32 to the semiconductor 14 and alsoform undercut regions 38 (e.g., wedge shaped undercut regions), underthe layer 20 between edges 18 of the openings 34 and the ends of theundercut regions 38 represented by the lines 22. As described below withrespect to the fabrication process, the undercut regions 38 between theedges 18 of the openings 34 and the lines 22 facilitate a liftoffprocess used in the fabrication of the detector 40.

The pixelated anodes 32 and a monolithic cathode 30 in one embodimentare metal contacts that may be made, for example, of Indium (In), Gold(Au), Platinum (Pt), or Aluminum (Al), among other metals, or may be astack of layers including some or all of these metals to produce Ohmicor blocking contacts. The gaps 24, which are the spaces under theencapsulation layer 20 between the undercut lines 22, are fabricatedbetween the anodes 32 without using chemical wet etch in variousembodiments.

It should be noted that a region L between the edges 18 of the openings34 marked by lines 26 and 28 are illustrated in the various figures in aside-view cross-section of the detector 40 oriented along line AA′.

FIGS. 2 and 3 illustrate a geometrical structure similar to thegeometrical structure of the side-view cross-section of the detector 40of FIG. 1 oriented along lines AA′ of FIG. 1. It should be noted thatthe proportion and/or scale between the different elements of thedetector 40 of FIG. 1 is different from the proportion and/or scalebetween the elements of the detectors 50 and 100 of FIGS. 2 and 3,respectively. Thus, even though the geometrical structures of thedetectors 40, 50 and 100 of FIGS. 1-3 are similar, the above mentionedproportions and/or scales of FIGS. 2 and 3 are different from theproportion and/or scale of FIG. 1 to clarify the illustration of theelements of detectors 50 and 100 of FIGS. 2 and 3, respectively. It alsoshould be understood that the detectors 40, 50 and 100 are schematicallyillustrated by FIG. 1-3, respectively and the proportions between theelements is not maintained to reflect the actual dimensions of theelements in these detectors.

More particularly, a monolithic cathode 52, semiconductor 54,encapsulation layer 56, pixelated anodes 58, surfaces 60 and 68 underanodes 58, undercuts regions 62 and 66 beneath a layer 56, gaps 64between anodes 58, and an interval L of FIGS. 2 and 3 correspond to themonolithic cathode 30, semiconductor 14, encapsulation layer 20,pixelated anodes 32, surfaces 36 under the anodes 58, undercut regions38 beneath the layer 20, gaps 24 between the anodes 32 and interval L ofFIG. 1, respectively.

As described in more detail herein, while the radiation detectors 50 and100 have similar geometrical structures, the fabrication processes foreach are different. In particular, the detector 50 is produced such thatgaps 64 between the anodes 58 are chemically etched before theencapsulation layer 56 is applied to the semiconductor 54 on top of thegaps 64. Unlike the detector 50, the detector 100 is produced such thatgaps 64 between the anodes 58 are not chemically etched before theencapsulation layer 56 is applied to the semiconductor 54 on top of thegaps 64.

In various embodiments, the chemical etching of the surfaces 60 and 68of the detector 50 and 100 is provided for:

1. Removing polishing mechanical-damage from the surfaces of thesemiconductor 54 from which detector 50 is made; and

-   -   2. Creating non-stoichiometric surfaces 60, 68 and 78 of the        semiconductor 54 under the anodes 58 and the cathode 52 having        an excess of one of the components of the semiconductor 54, such        as an excess of Tellurium (Te) when the semiconductor 54 is a        CZT semiconductor and is chemically etched by Bromine Methanol        or Bromine Ethylene Glycol. This non-stoichiometric surface with        the excess of one of the elements of the semiconductor 54 can        improve the quality of the electrical contacts of the anodes to        the semiconductor 54.

The detector 50 of FIG. 2 includes gaps 64 between the anodes 58 havingchemically etched surfaces 76 under the encapsulation layer 56. Thesurfaces 76 of the gaps 64 similar to surfaces 60, 68 and 78, are etchedby a chemical wet process and thus, are non-stoichiometric surfacesincluding excess of one of the elements of semiconductor 54.

As described above, the excess of one of the elements of semiconductor54, such as excess Te produced when the semiconductor 54 is a CZTsemiconductor and is chemically etched by Bromine Methanol or BromineEthylene Glycol, is provided in surfaces 60, 68 and 78 so as to improvethe quality of the electrical contacts between the semiconductor 54 andmetal electrodes 58 and 76 formed on surfaces 60, 68 and 78 in variousembodiments. However, this is not the case with the chemically etchedsurfaces 76 of the gaps 64 between the anodes 58 located under theencapsulation layer 56, for example, with the excess Te produced on thesemiconductor 54 when etching the CZT semiconductor 54 by a chemical wetetch using Bromine Methanol or Bromine Ethylene Glycol. The presence ofTe, Bromine (Br₂), Oxygen (O), Humidity (H₂O) and other materials thatmay be present on the surfaces 76 of the gaps 64 between the anodes 58of the detector 50 during the fabrication process of the detector 50,create a film or layer on top of the surfaces 76 that is made of acompound of at least part of the chemical materials described above.

The film or layer on top of the surfaces 76 has a resistivity that isrelatively low in comparison to the resistivity of the bulk of thesemiconductor 54. This low resistivity affects the line distribution oflines 70 of the electrical field that exist in the detector 50 when thedetector 50 is electrically biased between the cathode 52 and the anodes58, such as when the anodes 58 are biased with a voltage that is morepositive than the voltage applied to the cathode 52.

The lower the resistivity of the layer produced by the wet chemical etchof the semiconductor 54 on top of the surfaces 76, the more lines 70 ofthe electric field are oriented toward the gaps 64. These lines 70 ofthe electrical field oriented toward the gaps 64 between the anodes 58are identified as a group of lines 72.

In operation, photons that are detected and absorbed by the detector 50,produce charge carriers in the form of electrons and holes. In some ofthe events, the electrons drift along the electrical field lines 70toward the anodes 58 to produce an electrical signal that isproportional to the energy of the photon absorbed and detected by thedetector 50. In the events when the detected photons are absorbed in thedetector 50 in regions beneath the gaps 64, the electrons produced bythe absorption of the detected photons in the semiconductor 54 driftalong the lines 72 toward the regions 64 between the anodes 58. Thetrajectories of the electron drift along the lines 72 create atransportation path of the electrons in which the electrons arrive atthe surface 76 prior to collection of the electrons by the anodes 58.

When the electrons arrive at the surface 76, at least part of theelectrons recombine at the surface 76 by surface recombination and onlypart of the electrons arrive at the anodes 58 and are collected at theanodes 58. When only part of the electrons arrives at the anodes 58, thecharge collection by the anodes 58 is incomplete.

When the charge collection by the anodes 58 is incomplete, theperformance of the detector, such as energy resolution and sensitivitycan degrade, thereby resulting in a lower quality detector. The surfaces76 of the gaps 64 between the anodes 58 of the detector 50 arechemically etched after being polished by a suitable (e.g., standard)mechanical process to remove the mechanical damage produced by thestandard mechanical polish. The mechanical damage left after themechanical polish reduces the resistivity of the surfaces 76 andincreases the surface recombination of the electrons arriving to thesurfaces 76 along the lines 72, resulting in strong incomplete chargecollection by the anodes 58. Thus, the surfaces 76 have even lowerresistivity than after the chemical etch if the surfaces 76 are leftonly with the mechanical polish without the chemical wet etch.

In addition to the incomplete charge collection by the anodes 58, thelayer on top of the surfaces 76 under the encapsulation layer 56produced by the chemical etch of the semiconductor 54 is chemicallyactive even after the encapsulation by the encapsulation layer 56 andcauses the detector 50 to further degrade with time. This degradation isdue to further reduction in the resistivity of the layer on top of thesurfaces 76 under the encapsulation layer 56, even after being installedin a system operating at a site (e.g., at a hospital).

Since the detector 50 has reduced quality, the number of detectors thatcan be fabricated to meet a certain specification is reduced as well. Inthis case, the production yield may be relatively low and themanufacturing cost relatively high, and also with the instability andreliability problems.

Accordingly, the detector 50 may have:

1. Reduced quality due to incomplete charge collection that degrades theenergy resolution and sensitivity of the detector.

2. Instability and low reliability caused by the continuous chemicalactivity of the layer formed on top of the surfaces 76 under theencapsulation layer 56, by the wet chemical etching.

3. Relatively low production yield resulting at a relatively highmanufacturing cost.

4. Relatively low commercial value.

The detector 100 of FIG. 3 is fabricated in accordance with otherembodiments by a different approach. In the detector 100, the surfaces76 are not chemically etched and are polished by non-standard polishingsteps. In various embodiments, the top first surface of the detector 54is very gently polished (as described in more detail herein) by amechanical non-standard polish to leave the first top surfacesubstantially damage free. In this case, the first top surface of thedetector 100 is left without wet chemical etch since there is no need toremove the mechanical damage of the polish because there issubstantially no damage in this surface.

Thus, without the chemical wet-etch, the first top surface of thedetector 100 has a stoichiometric structure with no excess of one of theelements of the semiconductor in these surfaces. After the non-standardmechanical polish of the top first surface of the detector 100, thissurface is partially etched, by chemical wet etch, to etch only thesurfaces 60, 62, 66 and 68. The chemical etched in the regions 60, 62,66 and 68 improves the electrical contact between the anodes 58 and thesemiconductor 54. After the partial etch of the top first surface of thedetector 100, the surfaces 76 on top of the regions 64 are leftpartially without being chemically etched and are processed only by thegentle non-standard mechanical polish.

In various embodiments, the surfaces 76 of the gaps 64 between theanodes 58 of the detector 100 are substantially damage free and withoutthe relatively low-resistivity layer, which exists on the top ofsurfaces 76 of the detector 50 of FIG. 2, resulting in high resistivitygaps 64 between the anodes 58 of the detector 100.

Accordingly, the surfaces 76 have a resistivity that is similar to theresistivity of the bulk of the semiconductor 54 (also referred to asbulk resistivity). This relatively high resistivity affects the linedistribution of the lines 70 of the electrical field in the detector 100when electrically biased between the cathode 52 and the anodes 58, suchas when the anodes 58 are biased with a voltage that is more positivethan the voltage applied to the cathode 52.

The relatively high resistivity of the surfaces 76 of the gaps 64,produced by the gentle non-standard mechanical polish and without thewet chemical etch of the semiconductor 54 on top of the surfaces 76,reduces the number of lines 70 of the electric field, oriented towardthe gaps 64, into substantially a single line 74. The single line 74always exists due to the geometrical symmetry between biased anodes 58and is independent of the resistivity of the surfaces 76.

In operation, photons that are detected and absorbed by the detector100, produce charge carriers in the form of electrons and holes. Theelectrons drift along the electrical field lines 70 toward the anodes 58to produce an electrical signal that is proportional to the energy ofthe photon absorbed and detected by the detector 100. Even in the eventwhen the detected photons are absorbed in the detector 100 in regionsbeneath the gaps 64, most of the electrons produced by the absorption ofthe detected photons in the semiconductor 54 drift along the majority ofthe lines 70 toward the anodes 58 and few drift along the single line 74toward the regions 64 between the anodes 58. The trajectories of the fewelectrons that drift along the single line 74 create a transportationpath of the electrons in which the electrons arrive at the surface 76prior to collection of the electrons by the anodes 58.

The few electrons that still arrive at the surfaces 76 suffer very lowsurface recombination because the surfaces 76, polished by thenon-standard gentle polish, are substantially damage free, thus,electrons arriving at the anodes 58, via the surfaces 76, substantiallydo not suffer from incomplete charge collection by the anodes 58.Because few electrons arrive at the surfaces 76 prior to collection bythe anodes 58 and because the few electrons that still arrive at thesurfaces 76, along the single line 74, substantially do not suffer fromsurface recombination, the incomplete charge collection of the detector100 is negligible in various embodiments.

When the charge collection by the anodes 58 of the detector 100 issubstantially complete, the performance of the detector 100, such asenergy resolution and sensitivity are improved in various embodimentsand the detector has higher performance and is of higher quality.Various embodiments, thus, produce detectors 100 that meet a desired orrequired specification and enable high production yield at relativelylow cost.

As described above, the surfaces 76 of the gaps 64 between the anodes 58of the detector 100 are gently polished, by a non-standard polishprocess and even though the surfaces 76 are processed without chemicalwet etched, the surfaces 76 are substantially damage free due to thegentle non-standard polish process. Thus, the detector 100 has nolow-resistivity layer on top of the surfaces 76 under the encapsulationlayer 56, which is chemically active even after the encapsulation,increasing the stability and reliability of the detector 100.

Thus, by practicing various embodiments, the detector 100 is providedthat has:

1. High quality due to substantially complete charge collection thatimproves the energy resolution and sensitivity of the detector.

2. High stability and reliability caused by the gentle and non-standardmechanical polish of the surfaces 76, which is not followed by chemicaletch and thus has no low resistivity and chemically active layer on topof the surfaces 76 under the encapsulation layer 56.

3. High production yield resulting in relatively low manufacturing cost.

4. High commercial value.

FIGS. 4-12 schematically illustrate the fabrication steps according toone embodiment for fabricating a detector, such as the detector 100 ofFIG. 3. It should be noted that the same referral numerals are used inthe various figures to describe similar parts. To clarify the figuresand for ease of understanding of the fabrication steps of the detectorschematically illustrated by FIGS. 4-12, the interval L shown in FIGS.1-3 is magnified and substantially only this interval of the detector100 of FIG. 3 is illustrated by FIGS. 4-12. It should be noted that eventhough FIGS. 3-12 illustrate the detector 100 with different schematicperspective views, the figures may show the detector 100 with differentproportions between the various parts.

FIG. 4 schematically shows the semiconductor 54 that may be made of aCZT wafer having a width L, a first top surface 51 and a second lowersurface 53. In the first fabrication step of the detector 100 as shownin FIG. 4, the first and second surfaces 51 and 53 of the semiconductor54 are mechanically polished in a process that may include double sidepolishing or side by side polish. The polishing includes severalpolishing steps in which each successive polishing step is performedwith a slurry having grains, such as alumina, silica or silicon carbidegrains, which are smaller than the grains in the slurry of the previouspolishing step. In each polishing step of the semiconductor wafer 54,the mechanical damage left in the surface of semiconductor 54, after thepolish step, is proportional to the grain size in the slurry used inthis polishing step.

The sequence of polishing steps is provided to remove the mechanicaldamage of the previous polishing step by the next polishing step whilethe damage left in the first and second surfaces 51 and 53 of thesemiconductor 54 after the next polishing step is smaller than thecorresponding damage left in the surfaces 51 and 53 of the semiconductorwafer 54 after the previous polishing step because the next stepincludes a slurry with smaller grains. Accordingly, the mechanicaldamage in the surfaces 51 and 53 reduces with the amount of steps in thesequence of the polishing process in various embodiments.

The detector 100 is, thus, fabricated by polishing and etching methodsdescribed below. In particular, in one embodiment, in the fabricationprocess of the detector 100 of FIG. 3, the semiconductor wafer 54 ofFIG. 4 is polished with a longer polishing sequence including morepolishing steps, such as that are used in the polishing sequence of thedetector 50. For example, in various embodiments, four polishing stepsare performed with the last step in the sequence of the polishing stepsof the detector 100 including a slurry with a grain size less than 0.1μm, for example, a grain size of 0.05 μm. In one embodiment, thesequence of polishing includes the use of a series of slurries havinggrain sizes of 9 μm, 1 μm, 0.6 μm and 0.05 μM in polishing steps 1 to 4,respectively.

The small size of the grains involved in the polishing of the surfaces51 and 53 of wafer 54 of FIG. 4, leaves these surfaces substantiallydamage free with a resistivity that is similar to the resistivity of thebulk of the semiconductor wafer 54. In this process of fabricating thedetector 100, the surfaces 76 above the gaps 64 between the anodes 58 ofFIG. 3 have a resistivity that is very high and is suitable to producethe detectors 100 without chemical etching of the surfaces 76 of FIG. 3and as shown in FIG. 4.

FIG. 5 schematically illustrates the semiconductor wafer 54 in thesecond step of fabricating the detector 100. In this step, theencapsulation layer 56 is applied to the first surface 51 of the wafer54 in a process that may include, for example, evaporation, spatteringor deposition of the encapsulation layer 56 on the surface 51. In oneembodiment, where the wafer 54 is made of a CZT semiconductor, theencapsulation layer 56 may be made of Zinc Sulfide (ZnS). Theencapsulation layer 56 protects and seals the first surface 51 frombeing exposed to contamination and humidity that may cause resistivityreduction of the surfaces 76 on top of the gaps 64 under the layer 56 ofFIG. 3.

The encapsulation layer 56 generally has a good adhesion to the surface51 of the wafer 54 with a lattice constant similar to the latticeconstant of the semiconductor wafer 54. The lattice match between theencapsulation layer 56 and the semiconductor wafer 54 reduces the stressin the interface between the layer 56 and the surface 51 of the wafer54. Such stress may cause damage to the surface 51, which may result inan undesired reduction of the resistivity of the surface 51. Accordinglyfor example, the ZnS layer 56 is used for the encapsulation of the CZTwafer 54 as the lattice constant of each is similar and a close match.To further reduce the stress between the CZT wafer 54 and theencapsulation ZnS layer 56, the encapsulation layer 56 may be formedwith a thickness that allows the encapsulation layer 56 to be stretchedalong the surface 51 to reduce the stress in the interface between thelayer 56 and the surface 51 of the CZT wafer 54. For example, in theprocess illustrated by FIG. 5, the thickness of the ZnS layer 56 on theCZT wafer 54 may be about 0.17 μm. However, other thicknesses may beused.

FIG. 6 is schematic illustration of the third step in fabricating thedetector 100. In this step, a photoresist layer 102 is applied on top ofthe encapsulation layer 56 to form a patterned photoresist layer usingUV irradiation through a patterning mask. The photoresist layer 102 maybe of a positive or negative type and generally has good adhesion to thelayer 56. The thickness of the photoresist layer 102 is thin enough invarious embodiments to allow patterning of the layer and thick enough toensure effective liftoff process in another processing step as isdescribed below in connection with FIG. 12. For example, FIG. 6illustrates the photoresist layer 102 as being of a positive type withthickness of 1.5 μm, which is spread over the layer 56 using a spinnerto spin the wafer 54. However, other thickness may be used.

FIG. 7 schematically illustrates the fourth step in fabricating thedetector 100. After the third fabrication step of the detector 100 andprior to this fabrication, the photoresist layer 102 is exposed topatterned UV illumination via a patterning mask using, for example, asuitable mask-aligner system and is backed in a furnace to produce softbacking of the photoresist layer 102. In the fourth fabrication stepillustrated by FIG. 7, the photoresist layer 102 is developed and partsof the photoresist layer 102 are removed according to the patterned UVillumination of the layer 102 in the mask-aligner system usingphotolithography techniques to form openings 101 in the photoresistlayer 102 above the encapsulation layer 56. After this step, thephotoresist layer 102 is hardly backed making the photoresist layer 102resistible to acids.

FIG. 8 is a schematic illustration of the fifth fabrication step of thedetector 100. In this step, the encapsulation layer 56 is etched via theopenings 101 in the photoresist layer 102 to form openings 103 in theencapsulation layer 56. The etching of the layer 56 may be performed,for example, by a dry-etch process, such as ion-milling or by chemicalwet etch. When wet chemical etching is used to produce the openings 103in the layer 56, in various embodiments a selective etchant that etchesonly the layer 56 and substantially does not etch the semiconductor 54or etch the semiconductor wafer 54 very slowly is used. In this case,the surface 51 of the semiconductor wafer 54 is a stop etch surfacewhere the etching stops. In this embodiment, the etching of the layer 56may be better controlled and the wafer 54 is substantially not etched.

For example, when the wafer 54 is a CZT wafer and the encapsulationlayer 56 is made of ZnS, the selective etchant used to etch the layer56, via the openings 101, to form the openings 103 in the encapsulationlayer 56 in one embodiment is HCl. During the formation of the openings103 in the ZnS layer 56, the CZT wafer 54 is not etched and the undercut105 in the encapsulation layer 56 is formed under the photoresist layer102.

FIG. 9 schematically illustrates the sixth fabrication step used toproduce the detector 100. In this fabrication step the semiconductorwafer 54 is etched, via the openings 101 in the photoresist 102 and theopenings 103 in the encapsulation layer 56 to produce the etched regions68 having the undercuts 66 under the encapsulation layer 56. In oneembodiment, a selective etchant is used that does not attack thephotoresist layer 102 and does not etch the encapsulation layer 56.Accordingly, the etching of the wafer 54 may be more controlled andaccurate. For example, when the wafer 54 is made of CZT, the layer 102is made of a photoresist and the layer 56 is made of ZnS, the selectiveetchant may be Bromine Methanol, Br₂HBr or Bromine Ethylene Glycol,which etch the CZT wafer and do not attack the layers 102 and 56.

As described above in connection with FIGS. 1 and 2, the chemical wetetching of the surfaces 68 of detector 100, as shown in FIG. 9, isperformed for creating the non-stoichiometric surface 68 of thesemiconductor wafer 54 under the anodes 58 and the cathode 52 (as shownin FIG. 11) having excess of one of the components of the semiconductor54. For example, such excess of Te is created when the semiconductor 54is a CZT semiconductor and is chemically etched by Bromine Methanol orBromine Ethylene Glycol. This non-stoichiometric surface with the excessof one of the elements of the semiconductor 54 improves the quality ofthe electrical contacts of the anodes 58 and the cathode 52 (shown inFIG. 11) to the semiconductor 54.

The regions 68 of the surface 51 and the surface 53 under cathode 52 areetched from the wafer 54. The surface 53 on which the cathode 52 isformed (shown in FIG. 11), may be etched simultaneously with the surface51 or at a later fabrication step (e.g., sequentially or concurrently)

The surfaces 68 of the semiconductor 54 under the anodes 58 of thedetector 100 are chemically etched via the openings 103 in the layer 56to form the undercut regions 66, under the layer 56. As described below,with respect to the fabrication process, the undercut regions 66 at theedges of the regions 68 allow for a liftoff process used in thefabrication of the detector 100 as shown in FIGS. 11 and 12.

The partial etch of the regions 68 from the surface 51 of the wafer 54is done only via the openings 101 and 103 of the layers 102 and 56,respectively in various embodiments. In these embodiments, the surfaces76 on the gaps 64 between the regions 68 are left without chemical wetetching and thus have a surface resistivity corresponding to the gentlenon-standard mechanical polish of the surfaces 76, which is similar tothe resistivity of the bulk of the wafer 54.

FIG. 10 is a schematic illustration of the seventh fabrication step ofthe detector 100. In this fabrication step, the anodes 58 are formed onthe regions 68. Forming the metal contact of the anodes 58 may be done,for example, by metal evaporation using a heated crucible or e-gun,metal spattering, electroplating or electro-less processes, amongothers. As described above the metals used to form the anodes 58 may beIn, Au, Pt, Al, among others, or a stack of layers including some or allof these metals. The type of metals used may determine whether theproduced electrical contacts are Ohmic or blocking contacts.

For example, FIG. 10 shows the anodes 58 formed by evaporation of In allover the top surface of the CZT wafer 54. In one embodiment, the Inlayer 104 is formed on top of the photoresist layer 102 and the anodes58 are formed on the etched regions 68. In this embodiment, the In anodecontacts on the CZT wafer 54 create an electrical Ohmic contact.

It should be noted that the anodes 58 are part of In layer 104. It canbe seen that the anodes 58 and the In layer 104 are not connected due tothe undercut 105 (as shown in FIG. 9) of the layer 56 under the layer102 and the undercut 66 of the wafer 54 under the layer 56. Thediscontinuity between the layer 104 and the anodes 58 is formed by theshadowing effect of the undercuts 105 and 66 that block the evaporationpaths in the intervals between the layer 104 and the anodes 58. Theexistence of the undercuts 105 and 66 that produces the discontinuitybetween the In layer 104 and the anodes 58 is useful in the liftoffprocess as illustrated by FIGS. 11 and 12 and as described below.

FIG. 11 schematically illustrates the eight fabrication step of thedetector 100. In this fabrication step, the cathode 52 is applied to thesurface 53 of the semiconductor wafer 54. As described above, thecathode 52 may be applied to the etched surface 53 after the top andlower surfaces 51 and 53 are etched simultaneously or after the surfaces51 and 53 are etched in different fabrication steps, such as the stepsillustrated by FIGS. 9 and 11, respectively. The cathode 52 is appliedon the surface 53 that, due to its chemical etching, isnon-stoichiometric and is rich with one of the elements of thesemiconductor 54 to improve the electrical contact of the cathode 52 tothe surface 53 of the semiconductor wafer 54.

When the formation of the pixelated anodes 58 and the monolithic cathode52 are produced by a metallization process including electroplating orelectro-less, both the anodes 58 and the cathode 52 may be formedsimultaneously on both sides of the wafer 54 in the top first surface 51and the lower surface 53. If an evaporation process is used to form thepixelated anodes 58 and the monolithic cathode 52, the anodes 58 and thecathode 52 may be formed at different fabrication steps, such as thefabrication steps shown in FIGS. 10 and 11, respectively. For example,the application of the In cathode 52 shown in FIG. 11 is performed by anevaporation process. In the examples illustrated by FIGS. 10 and 11, thethickness of In layers of the anodes 58 and the cathode 52 in oneembodiment may be about 0.34 μm. However, different thicknesses may beused.

FIG. 12 is a schematic illustration of the detector 100 having astructure similar to the detector 40 schematically illustrated inFIG. 1. FIG. 12 schematically illustrates the ninth fabrication step ofthe detector 100. In this fabrication step, the liftoff process isconducted to remove the In layer 104 (shown in FIG. 10) and thephotoresist layer 102 from the encapsulation layer 56. During theliftoff process the photoresist layer 102 is exposed, for example, toAcetone that causes the layer 102 to be swollen first and later to bedissolved in the Acetone to be washed out together with the In layer104. The efficiency of the liftoff process is increased due to theundercut 105 in the encapsulation layer 56 under the photoresist layer102 and mainly due to the undercut 66 in the semiconductor 54 under thelayer 56. These undercuts allow free access of the Acetone, via thediscontinuity between the layer 104 and the anodes 58, to reach thephotoresist layer 102 for being swollen and dissolved for removing theIn layer 104. Thus, the creation of the undercuts 105 and 66 facilitateachieving an efficient liftoff process to assure fabrication of detector100, such as with high production yield.

As described above, the discontinuity between the layer 104 and theanodes 58, which is used for the liftoff process, is formed by theshadowing effect of the undercuts 105 and 66 that block the evaporationpaths in the intervals between the layer 104 and anodes 58. Theexistence of the undercuts 105 and 66 that produces the discontinuitybetween the In layer 104 and the anodes 58 facilitates the liftoffprocess as illustrated by FIGS. 11 and 12 as described above.

FIG. 13 is a process flowchart illustrating and describing theprocessing steps in the fabrication sequence of a detector, for example,the detector 100 illustrated by FIGS. 4-12. The fabrication stepsillustrated by FIGS. 4-12 (which in the illustrated embodiment includenine steps) correspond to the steps 152-168 illustrated by the flowchart150 as described in more detail above. In general, a gentle polish at152 is followed by the application of an encapsulation layer at 154 onthe top of the surface of the anode side. A photoresist layer is appliedat 156 on top of the encapsulation layer, which is deposited on thesurface of the anode side. Photolithography patterning of thephotoresist layer is then performed at 158 to form openings in thephotoresist layer above the encapsulation layer in the anode side.

A wet etching of at least the encapsulation layer via the openings inthe photoresist in the anode side is then performed at 160 to formopenings in the encapsulation layer. A simultaneous or concurrent wetetch of the semiconductor surfaces in the cathode side and the anodeside via the opening in the photoresist and the encapsulation layers isthen performed at 162. Metal contacts are then deposited on the anodesat 164 and monolithic metal contacts are deposited in the cathode sideat 166. A lift off process in the performed at 168.

Accordingly, by practicing various embodiments a detector may befabricated with an efficient fabrication process due to a highproduction yield achieved. The formation of the undercuts 105 and 66facilitate the fabrication process. The gentle non-standard polishingtogether with the partially etched top first surface 51 produce the gaps64 having the high resistivity surfaces 76 with a resistivity similar tothe resistivity of the bulk of the semiconductor 54 resulting in ahigher performance radiation detector produced with high productionyield at relatively low cost.

Variations and modifications are contemplated. For example, although thesemiconductor 54 in various embodiments is described as being a CZTsemiconductor, the semiconductor may be formed from any suitablematerial. Additionally, although the anodes 58 and the cathode 52 aredescribed as made of In, the anodes 58 and the cathode 52 may be formedfrom any type of material, particularly any type of metal. Moreover,although the electrical contacts of the anodes 58 and the cathode 52 aredescribed as Ohmic contacts, the electrical contacts may be other typesof contacts, such as blocking contacts. Also, although the first andsecond surfaces 51 and 53 of the semiconductor 54 are described as beingpolished simultaneously in the same fabrication step, the first andsecond surfaces 51 and 53 may be polished at different fabricationsteps, which may or may not be concurrent.

Additionally, although the anodes 58 and the cathode 52 are described asbeing produced in different fabrication steps, they may be formedsimultaneously or currently at the same fabrication step. Further,although the grains in the slurry used in the last polishing steps aredescribed in one embodiment as having a size of 0.05 μm, these grainsmay have any size, such as less than 0.1 μm. Also, the size of thegrains of the slurry of the various polishing steps may have any size.

Thus, various embodiments provide methods for fabricating a radiationdetector, such as a pixelated radiation detector without chemicaletching to remove damaged layers. Accordingly, in various embodiments,no chemical etching is used between the anode contacts.

In other embodiments, methods for fabricating a radiation detector, suchas a pixelated radiation detector, such as a pixelated semiconductorradiation-detector wherein the surface of the anodes is produced by acomplete dry-process with no wet chemical etch, which may be activeafter the detector fabrication and may result in lower surfaceresistivity and detector performances that degrade less with time. Inthese methods the surface side of the anodes is not just encapsulatedbut, is also passivated, by a passivation process, which produces bothencapsulation and surface stabilization that may result in high surfaceresistivity.

The methods described below to produce a pixelated semiconductorradiation-detector may be performed by a simple process which on theanodes side does not include any wet chemical etching, lift-off process,and may not include photolithography in some embodiments. The pixelatedsemiconductor radiation-detectors produced in accordance with variousembodiments may have electrical rectifying anodes that are based onMetal-Oxide-Semiconductor (MOS) contacts having a strong tunnelingeffect. In some embodiments, the tunneling effect is produced by thecreation of energy levels in the energy-gap of the passivation layercreated by reactive ions or mechanical stress between the metal contactsof the anodes and the passivation layer.

It should be noted that pixelated semiconductor radiation-detectorsfabricated in accordance with various embodiments may haveblocking-diode anodes contacts made of metals, such as Indium orPlatinum, which are either not otherwise suitable to produce blockingcontacts on Cadmium-Zinc-Tellurium (CZT) semiconductors or produce, on aCZT material, Schottky contacts. The pixelated semiconductorradiation-detectors may have electrical rectifying anodes and a steeringgrid with low leakage current between the steering grid and the anodes.

In various embodiments a dry fabrication process may be provided asillustrated in FIGS. 14-20, for example, to fabricate pixelatedradiation-detector as is described below. In particular, FIG. 14illustrates the first processing step of producing a radiation detector.It should be noted that the illustration of FIG. 4 is similar to thatillustrated by FIG. 14. Accordingly, the description above for FIG. 4will not be repeated here and it should be appreciated that the surfaces200 and 202, and the semiconductor 204, of FIG. 14 correspond to thesurfaces 51 and 53, and the semiconductor 54, of FIG. 4, respectively.

FIG. 15 shows the formation of a passivation layer 206 grown on thesurface 200 of the semiconductor 204 that may be made, for example, of aCZT semiconductor. The passivation layer 206 may be formed by growingthe passivation layer 206 on top of the semiconductor 204 in oneembodiment using a plasma process that may include:

-   -   1. Cleaning the surface 200 by using plasma of mixture of gases        such as, Methane, Argon and Hydrogen to clean the surface 200        from any residual of metallic contamination by creating        volatility components that are pumped out from the chamber where        the semiconductor wafer 204 is placed. The mixture of gases, at        a pressure of less than 1 mTorr is purged into the chamber where        the semiconductor 204 is placed and the plasma of the mixture of        gasses is created by ionizing process including irradiating the        mixture of gases with microwave radiation at a power of about        100 Watt and a frequency of 13.56 MHz.    -   2. Growing the passivation layer 206 by a flow of oxygen plasma        at a pressure of about 0.3-0.5 mTorr at a flow rate of about 2        standard cubic centimeters per minute (seem). The plasma of the        oxygen is created by an ionizing process including irradiating        the oxygen gas by microwave radiation at a power of about 100        Watt and frequency of 13.56 MHz. In the initial process of        growing the passivation layer 206, the residual of organic        materials left after the plasma cleaning process, described        above, and residuals produced during the plasma cleaning process        due to dissociation of the methane gas, such as carbon, are        removed by burning and pumping out of the chamber.

The thickness of the passivation layer 206 in some embodiments is about3-6 nanometers (nm). It should be noted that the thickness of thepassivation layer 206, under the conditions described above, increaseswith the plasma processing time until reaching a saturated thicknessvalue of about 6 nm after 10 minutes.

In the case of the CZT semiconductor 204, the passivation layer 206includes Tellurium dioxide (TeO₂) wherein the fraction thereof in thepassivated oxide layer (namely the passivation layer 206) depends onsurface preparation and the plasma cleaning conditions, such as theplasma cleaning time and type of gases used in this process.

It should be noted that the passivation layer 206 is also anencapsulation layer that protects the surface 200 on which this layer isgrown to form a high resistance surface having resistivity that issimilar to the resistivity of the semiconductor bulk.

FIG. 16 schematically illustrates the step of the application of metalcontacts on top of the passivation layer 206 to form anodes 208 withgaps 210 between the anodes 208, which are not coated with metal. Thegaps 210 with the grown encapsulation and passivation layer 206 have ahigh surface resistance for high performance radiation-detectors (asillustrated by FIG. 3 and described above) and are sealed (encapsulated)for stable, reliable and non-degraded detectors. A semiconductor, suchas the semiconductor 204, on which a passivation oxide layer, such asthe passivation layer 206, is grown has high surface resistance that maybe equal to the resistance of the bulk material. In addition, thepassivation layer 206 is chemically inactive and thus very stable andsuitable for producing radiation-detectors that do not degrade with timeor have a reduced likelihood of degrading over time.

The anodes 208 may be produced by a photolithography technique in someembodiments. However, in other embodiments, the anodes 208 are formed bymetal evaporation, in a vacuum chamber, through a shadowing mask. In oneembodiment the anodes 208 have a thickness of about 0.3 μm. However, theanodes 208 can be formed to have different thickness. The anodes 208 invarious embodiments are formed from metals that are either reactivemetals, such as Indium and Aluminum or rigid metals, such as Nickel andPlatinum. In both types of the metals, energy levels are created in theenergy-band of the passivated layer 206 to increase the tunneling effectof electrons passing through passivation layer 206 from thesemiconductor 204 to the metal contacts, as is shown in FIG. 23 formetal 254 and semiconductor 260 as described below.

FIG. 17 schematically illustrates a protection step for the anodes 208by applying a protective layer 214 on top of the anodes 208. Theprotective layer 214 may be, for example, an adhesive tape or other typeof materials, such as photoresist or resist formed on the anodes 208 andthe surface of the passivation layer 206 in the regions of gaps 210.This protective layer 214 protects the anode surface during the nextstep when the surface 202 of the semiconductor 204 is treated byetching.

FIG. 18 schematically illustrates a preparation processing step for thesurface 202, which prepares the surface 202 for the application of amonolithic cathode contact 212 (of FIG. 19) on top of the surface 202 ofthe semiconductor 204 while the anodes surface is protected by theprotective layer 214. The surface 202 may be etched by chemical wetetching. When the semiconductor 204 is made of CZT, this process mayinclude etching with Brome Methanol or Brome Ethylene Glycol or mayinclude dry etching such as ion etching.

FIG. 19 schematically illustrates the application of a cathode contact212 on the etched surface 202 while the protective layer 214 stillprotects the anodes surface. The cathode 212 may be produced, forexample, by metal evaporation, electroplating, electro-less or sprayingprocess. The cathode 212 may be of different types, such as an Ohmic,blocking or rectifying contact depending on the type of etching andmetal used to form cathode contact 212.

FIG. 20 schematically illustrates the final step in producing thepixelated radiation-detector 201, which includes the removal of theprotective layers 214 and cleaning the anodes surface. The cleaningprocess may include soaking the semiconductor 204 in solvents, such asacetone and methanol and drying using isopropanol and flow of drynitrogen or dry air.

The operation or behavior of a Metal-Oxide-Semiconductor (MOS) contacthaving inter-band energy levels in the band gap of the oxide region willnow be described. FIG. 21 schematically illustrates an energy-banddiagram 250 of metallic anode contacts 254, such as the anodes 208 shownin FIG. 20, placed on top of the oxide passivation layer 256, such asthe layer 206 of FIG. 20, grown on top of the semiconductor 260, such asthe semiconductor 204 of FIG. 20. This configuration is equivalent to aMOS structure.

FIG. 21 shows the energy-bands diagram of an unbiased MOS contactstructure, according to one embodiment, including a metallic region,namely the metallic anode contacts 254, an oxide region, namely theoxide passivation layer 256 that includes a passivation oxide layer 270and the semiconductor region 260, which correspond to the metallicanodes 208, passivation layer 206 and P-type semiconductor 204 of FIG.20.

The metallic region 254 has a Fermi-level 264. The oxide region 256 hasa valence-band energy 268 and a conductive-band energy 266. Thesemiconductor region 260 has a valence-band energy 280, intrinsicFermi-level 278, quasi Fermi-level 276 and conductive-band energy 274.The vicinity or location of the quasi Fermi-level 276 to thevalence-band 280 indicates that the semiconductor 260 is of a P-Type.

The energy difference between the metallic Fermi-level 264 of the metal254 and the vacuum level 252 is illustrated by the arrows 262 and isequal to eΦ_(M) when e is the electron charge and Φ_(M) is thework-function of the metal. Similarly, the energy difference between thequasi Fermi-level 276 of the semiconductor 260 and the vacuum level 252is illustrated by the arrows 272 and is equal to eΦ_(S) when e is theelectron charge and Φ_(S) is the work-function of the semiconductor.

For the simplicity of the drawings and the explanations of FIGS. 21-23,work functions Φ_(M) of the metal 254 and the work function Φ_(S) of thesemiconductor 260 are illustrated as being substantially equal, but maybe different in some embodiments.

The MOS structure of the anodes 208 of FIG. 20 is different from thestandard MOS contacts includes the presence of multiple energy-levels284 in the forbidden band-gap of the oxide passivation layer 270. Theinfluence of creating multiple energy levels 284 on the MOS contact willbe described first with reference to FIGS. 21-23. This description willbe followed by a description of the creation of the energy-levels 284.

FIG. 22 schematically illustrates the energy-band diagram 251 of themetallic anode contacts 254, such as the anodes 208 of FIG. 20, having aMOS configuration under the condition of forward bias, i.e. the metallicregion is biased negatively with respect to the semiconductor, which isequivalent to the bias of the anodes 208 negatively with respect tocathode 212 of FIG. 20. Under this bias, the Fermi-level 264 of themetal 254 (the anode 208 of FIG. 20) moves up by the amount eV, toappear as the Fermi-level 282, when V is the applied bias between themetal 254 and the semiconductor 260. Under the same bias, the inter-bandenergy-levels 284 have a gradient which is proportional to theelectrical field in the passivation layer 270. The conductive-band 274,valence-band 280 and intrinsic Fermi-level 278 of the semiconductor 160are all curved near the interface with the passivation layer 270 due tothe depletion process of electrons in the conductive-band 274 and theinversion process of holes in the valence-band 280 of the P-typesemiconductor 260, produced by the negatively biased anode 254 (theanodes 208 of FIG. 20). In addition, the conductive-band 274,valence-band 280 and intrinsic Fermi-level 278 of the semiconductor 260all have a gradient that is proportional to the electrical field in thesemiconductor 260. The energy-levels 284 in the forbidden bang-gap ofthe passivation layer 270 also have a gradient that is proportional tothe electrical field in the oxide region 256.

The energy-levels 284 in the forbidden bang-gap of the passivation layer270 may increase the tunneling effect to increase the transition of themajority charge-carriers, which are holes, from the valence-band 280 ofthe P-type semiconductor 260 to the metal 254 via the oxide 256.Accordingly, under the bias when the metal 254 (the anode 208 of FIG.20) is negative relative to the semiconductor 260 (the cathode 212 ofFIG. 20), the MOS contact has high conductivity via the inter-bandenergy-levels 284 in the forbidden band-gap of the passivation layer 270(the layer 206 of FIG. 20). Without the existence of the energy-levels284, the electrical current between the semiconductor 260 and the metal254 via the insulation oxide layer 270 would be limited to the quantumtunneling via the barrier layer 270 and thus, would be very low andinversely proportional to the exponential value of the thickness ofoxide 256 (insulator). Accordingly, the MOS contact with theinter-levels 284, with the energy-band structure 251 illustrated by FIG.22, has high conductivity (low resistance) and behaves like a rectifyingcontact under forward bias.

FIG. 23 schematically illustrates the energy-band diagram 253 of themetallic anode contacts 254 (the anodes 208 of FIG. 20) having the MOSconfiguration under the condition of reverse bias, i.e. the metallicregion is biased positively with respect to the semiconductor, which isequivalent to the bias of the anodes 208 positively with respect to thecathode 212 of FIG. 20. Under this bias, the Fermi-level 264 of themetal 254 (the anode 208 of FIG. 20) moves down by the amount eV, toappear as the Fermi-level 286, when V is the applied bias between themetal 254 and the semiconductor 260 and the energy-levels 284 have agradient which is proportional to the electrical field in thepassivation layer 270. The conductive-band 274, valence-band 280 andintrinsic Fermi-level 278 of the semiconductor 260 are all curved downnear the interface with the passivation layer 270 due to the inversionprocess of electrons in the conductive-band 274 and depletion process ofholes in the valence-band 280 of the P-type semiconductor 260, producedby the positively biased anode 254 (the anodes 208 of FIG. 20). Inaddition, the conductive-band 274, valence-band 280 and intrinsicFermi-level 278 of the semiconductor 160 all have a gradient that isproportional to the electrical field in the semiconductor 260. Theenergy-levels 284 in the forbidden band-gap of the passivation layer 270also have a gradient that is proportional to the electrical field inoxide region 256.

The location of the energy-levels 284 and the orientation of thecorresponding gradients in the forbidden bang-gap of passivation layer270 do not contribute to increase the tunneling effect of the transitionof the majority charge-carriers, which are holes, from the valence-band280 of the P-type semiconductor 260 to the metal 254 via the oxide 256.In this case, the energy-levels 284 do not enhance the tunneling processsince the location of the energy-levels 284 and alignment do not allowthe energy-levels 284 to produce electrical paths through which holescan pass from semiconductor the 260 to the metal 254.

Accordingly, under the bias when the metal 254 (the anode 208 of FIG.20) is positive relative to the semiconductor 260 (the cathode 212 ofFIG. 20), the MOS contact has high resistance characterized mainly bythe resistance of the insulative oxide layer 270 (the layer 206 of FIG.20) and the small quantum tunneling of holes via the barrier 270.Without the contribution of the inter-band energy-levels 284 to thetunneling process, the electrical current between the semiconductor 260and the metal 254 via the insulation oxide layer 270 is limited to thequantum tunneling via the barrier layer 270 and thus, is very low andinversely proportional to the exponential value of the thickness of theoxide 256 (insulator). Accordingly, the MOS contact with theinter-levels 284, with the energy-band structure 253 illustrated by FIG.23 behaves like a rectifying blocking contact.

From the description above for FIGS. 21-23, it is clear that due to theinter-band energy-levels 284 in the oxide region 270, the anodes 208 ofFIG. 20, having a MOS configuration similar to the one illustrated byFIGS. 21-23, behave like rectifying contacts having operation modes offorward-bias (low resistance) and reverse-bias (high resistance orblocking contact) as described above and illustrated by FIGS. 22 and 23,respectively.

FIG. 24 is a graph 300 showing a Current-Voltage (I-V) curve 301measured on the CZT detector 201 of FIG. 20. The measured current is thecurrent that flows into the anode 208 from the semiconductor 204 via thepassivation layer 206 as a function of the voltage applied between theanode 208 and the cathode 212 of FIG. 20 corresponding to themeasurement of the current that flows into the metal 254 from thesemiconductor 260 via the passivation layer 270 as a function of thevoltage applied between the metal 254 and the semiconductor 260 of FIGS.22 and 23, respectively. The values of the measured current flows in theanodes 208 in Ampere units [A] are marked along the Y-axis 302 of thegraph 300 and the values of the measured voltage between the anode 208and the cathode 212 in Volts units [V] along the X-axis 304 of graph300.

The negative values of the voltage between the anode 208 and the cathode212 appear in the negative part 306 of the X-axis of the graph 300. Thisregion corresponds to the situation illustrated by FIG. 22 in which theMOS contact is in forward-bias due to the tunneling enhanced by theinter-band energy-levels 284 in the passivation oxide layer 206 of FIG.20 (the oxide layer 270 of FIG. 22), resulting under these biasconditions, in an electrical conducting contact. The positive values ofthe voltage between the anode 208 and the cathode 212 appear in thepositive part 308 of the X-axis of the graph 300. This regioncorresponds to the situation illustrated by FIG. 23 in which the MOScontact is in reverse-bias (blocking state) since, in this situation,the inter-band energy-levels 284 do not contribute to the enhancement ofthe tunneling in the passivation layer 206 of FIG. 20 (the layer 270 ofFIG. 23) due to the position and the orientation of the correspondinggradient, resulting, under these bias conditions, in a high resistanceelectrically blocking contact.

From the graph 300, it can be seen that the anode contact 208 behaves asa rectifying contact having forward and reverse bias, which is differentfrom conventional MOS contacts that behave like a blocking contact, inboth directions, for any applied bias and polarity.

FIG. 25 is a graph 320 showing the resistance curve 321 as measured onthe CZT detector 201 of FIG. 20. The measured resistance is theresistance between the anode 208 and the cathode 212 of FIG. 20 measuredas a function of the voltage applied between the anode 208 and thecathode 212 of FIG. 20 corresponding to the resistance between the metal254 and the semiconductor 260 via the passivation layer 270 as afunction of the voltage applied between the metal 254 and thesemiconductor 260 of FIGS. 22 and 23, respectively. The values of themeasured resistance between the anodes 208 and the cathode 212 in Ohmunits [Ω] are marked along the Y-axis 324 of the graph 320 and thevalues of the measured voltage between the anode 208 and the cathode 212in Volts units [V] are marked along X-axis 322 of the graph 300.

The negative values of the voltage between the anode 208 and the cathode212 appear in the negative part 326 of the X-axis of the graph 320. Thisregion corresponds to the situation illustrated by FIG. 22 in which theMOS contact is in forward-bias due to the tunneling enhanced by theinter-band energy-levels 284 in the passivation oxide layer 206 of FIG.20 (the oxide layer 270 of FIG. 22), resulting, under these biasconditions, in a fixed low-resistivity contact. The positive values ofthe voltage between the anode 208 and the cathode 212 appear in thepositive part 328 of X-axis of the graph 320. This region corresponds tothe situation illustrated by FIG. 23 in which the MOS contact is inreverse-bias (blocking state) since, in this situation, the inter-bandenergy-levels 284 do not contribute to the enhancement of the tunnelingin the passivation layer 206 of FIG. 20 (the layer 270 of FIG. 23) dueto the position and the orientation of the corresponding gradient,resulting, under these bias conditions, in a high resistanceelectrically blocking contact.

From the graph 320, it can be seen that the anode contact 208 behaves asa rectifying contact, which is different from a conventional MOScontact. The resistance of the anode blocking-contact 208 may reachvalues that are several orders higher than the bulk resistance of theCZT semiconductor, which cannot be provided in CZT detectors when usingSchottky blocking contacts.

The fixed value of the resistance of anode contact 208 underforward-bias indicates that the density and uniformity of Inter-bandenergy-levels 284 are high thus, substantially the same enhancedtunneling is produced by Inter-band energy-levels 284 for each appliedforward-bias, resulting in low fixed resistance of anodes 208 underforward-bias.

From the above description it is clear that due to the unique formationof the inter-band energy-levels 284 in the oxide region 206 of FIG. 20(corresponding to the passivation layer 270 of FIGS. 21-23), the anodes208 of FIG. 20 (corresponding to the metal 254 of FIGS. 21-23) behave ina unique way that is different than the behavior of conventional OMS andSchottky contacts.

The formation of interbank energy levels in the oxide region will now bedescribed. The fabrication of the anodes 208 on the CZT detector 201 ofFIG. 20 and the formation of the inter-band energy-levels 284 of FIGS.21-23 may be accomplished, for example, by an evaporation process usingseveral types of metals applied on the passivation layer 206 produced,by plasma method, on the CZT detector 201 of FIG. 20, as follows:

-   -   1. High purity (five 9^(th)) Indium (In) (reactive metal thus        penetrates into the passivation layer)    -   2. Lower purity (three 9^(th)) Indium (In) (Metal having low        reactivity due to the low purity thus, does not penetrate into        the passivation layer, this metal is also soft and thus does not        produce mechanical stress on the passivation layer)    -   3. Platinum (Pt) (stiff and rigid metal thus, produces        mechanical stress on the passivation layer, this metal is also        non-reactive thus, does not penetrate into the passivation        layer)    -   4. Gold (Au) (soft metal and thus, does not, produce mechanical        stress on the passivation layer, this metal is also        non-reactive, thus, does not penetrate to the passivation layer)

The inter-band energy-levels 284 in the oxide layer 206 of FIG. 20 (theoxide layer 270 of FIGS. 21-23) may be produced by:

-   -   1. Mechanical Stress between stiff metal contacts 208 and oxide        layer 206, which produces local-damage in oxide layer 206        results with the formation of the inter-band energy-levels 284        in the forbidden-gap of the oxide layer 206.    -   2. Doping of the oxide layer by the reactive metal contact 208        having a portion thereof reactively diffuse into the oxide layer        206, as a doping material, to produce the inter-band        energy-levels 284 in the forbidden-gap of the oxide layer 206.        -   (a) When high-purity Indium (five 9^(th)) is evaporated to            produce anodes 208, these anodes may be been made from soft            metal which do not produce the amount of stress, between the            Indium contact 208 and the passivation oxide layer 206, used            to create the inter-band energy-levels 284 by mechanical            stress that creates the local damage in the oxide layer 206.            However, the high-purity Indium from which the nodes 208 are            made of, is a very reactive metal and has the other property            used to produce inter-band energy-levels 284 by at least            partially penetrating into the oxide layer 206, in a            diffusion process, to serve as a dopant which creates the            levels 284. Accordingly, the anodes 208 produced by            evaporation of high purity Indium on the CZT passivation            layer 206, exhibits the electrical behavior, of rectifying            contacts, shown in the graphs 300 and 320 of FIGS. 24 and            25, respectively, and are suitable to produce high yield            high performances CZT detectors.        -   (b) When lower-purity Indium (three 9^(th)) is evaporated to            produce the anodes 208, these anodes have may be made from            soft metal which do not produce the amount of stress,            between the Indium and the passivation oxide layer 206, used            to create the inter-band energy-levels 284 by mechanical            stress that creates the local damage in the oxide layer 206.            In addition, the metal of lower-purity Indium is not            reactive enough to produce the inter-band energy-levels 284            by at least partially penetrating into the oxide layer 206,            in a diffusion process, to serve as a dopant which creates            the levels 284. Accordingly, the anodes 208 produced by            evaporation of lower purity Indium on the CZT passivation            layer 206 do not exhibit the electrical behavior of            rectifying contacts, shown in the graphs 300 and 320 of            FIGS. 24 and 25, respectively, and are not suitable to            produce high yield high performances CZT detectors.        -   (c) When Platinum is evaporated to produce the anodes 208,            these anodes may be made from metal which is stiff and rigid            enough to produce the amount of stress, between the Platinum            metal (the anode 208) and the passivation oxide layer 206,            to create the inter-band energy-levels 284 by mechanical            stress that creates the local damage in the oxide layer 206.            However, the Platinum metal is not reactive enough to            produce the inter-band energy-levels 284 by at least            partially penetrating into the oxide layer 206, in a            diffusion process, to serve as a dopant which creates the            levels 284. Accordingly, the anodes 208 produced by            evaporation of Platinum on the CZT passivation layer 206,            exhibit the electrical behavior, of rectifying contacts,            shown in graphs 300 and 320 of FIGS. 24 and 25,            respectively, and are suitable to produce high yield high            performances CZT detectors due to the mechanical stress            produced on the passivation layer 206 to produce the levels            284 even though the Platinum is a non-reactive metal that            cannot produce doping in the layer 206, which is used to            form levels 206.        -   (d) When Gold metal is evaporated to produce the anodes 208,            these anodes may be made from soft metal which do not            produce the amount of stress, between the Gold metal (the            anodes 208) and the passivation oxide layer 206, to create            the inter-band energy-levels 284 by mechanical stress that            creates the local damage in the oxide layer 206. In            addition, the Gold contacts 208 are not reactive enough to            produce the inter-band energy-levels 284 by at least            partially penetrating into the oxide layer 206, in a            diffusion process, to serve as a dopant which creates the            levels 284. Accordingly, the anodes 208 produced by            evaporation of Gold on the CZT passivation layer 206, do not            exhibit the electrical behavior, of rectifying contacts,            shown in the graphs 300 and 320 of FIGS. 24 and 25,            respectively, and are not suitable to produce high yield            high performances CZT detectors.

From the various types of metals used to produce the anodes 208 on thepassivation layer 206 and the corresponding results, the followingshould be noted:

-   -   1. The anodes 208 with the inter-band energy-levels 284 can be        produced either by reactive metal, such as pure Indium that        diffuses into the passivation layer 206 to serve as a dopant to        create the levels 284 or can be produced by a stiff rigid metal,        such as Platinum that produces the mechanical stress on the        layer 206 to create local damage in the layer 206 to form the        inter-band energy-levels 284. Accordingly it should be        appreciated that metal, such Aluminum which is reactive and        rigid also may be used to produce the anodes 208, as described        above.    -   2. To create the mechanical stress for producing the local        damage that produces the inter-band energy-levels 284, stiff and        rigid metal contacts 208 on the passivation layer 206 are formed        thick enough to create such stress. In the case that the metal        contacts 208 are not thick enough, the contacts 208 may be        stretched to fit to the lattice constant of the layer 206        resulting in not enough stress to produce the levels 284.        Accordingly, the thickness of the stiff and rigid metal-contacts        208 that still can produce levels 284 in various embodiments is        the thickness that reduces the stretch of the contacts 208 on        the layer 206 by the amount that will create mechanical stress,        due to the lattice mismatch between the metal contacts 208 and        the layer 206, which is suitable for the creation of the levels        284.    -   3. In various embodiments, the metal-contacts 208 for on the        layer 206 are formed from Nickel (Ni).    -   4. In various embodiments, the reactive metals of the contacts        208, such as Indium and Aluminum are reactive enough and thus        pure enough to penetrate, by diffusion, into the passivation        layer 206 to create therein, by doping, the inter-band        energy-levels 284 to enhance the tunneling of charge-carriers        from and to the semiconductor 204 via the layer 206.

It should be noted that the electrical behavior of the anodes 208described above cannot be produced by conventional MOS or Schottkycontacts because MOS contacts do not include the levels 284 in the oxideregion and Schottky contacts do not have an oxide passivation layer.Additionally, a MOS Indium contact on a passivation layer without theinter-band energy-levels 284 is a blocking contact in both directionsfor any bias and polarity and an Indium contact on a CZT semiconductordoes not produce a Schottky contact and behaves like symmetric Ohmiccontact. In various embodiments, the Indium contact behaves like arectifying contact that cannot be achieved by a MOS contact nor by aSchottky contact.

Unlike MOS Platinum and Gold contacts on a passivation layer withoutinter-band energy-levels 284 that are blocking contacts in bothdirection for any bias and polarity, and Platinum and Gold contacts on aCZT semiconductor that produce Schottky contacts and behave likerectifying contact due to the values of corresponding working functionsrelative to the working function of the CZT semiconductor, in variousembodiments, the Platinum contact behaves like a rectifying contactwhile the Gold contact does not. Accordingly, the anodes 208 of FIG. 20are not of the type of Schottky since the Gold contact does not behavelike a Schottky contact as would be expected when the Platinum contactdoes behave like a Schottky contact.

Thus, it is clear, that the anodes 208 of FIG. 20 and the metal 254 ofFIGS. 21-23, are contacts that are neither conventional MOS contacts norSchottky contacts and are produced in various embodiments only by theformation of the inter-band energy-levels 284 in the passivation layer206 of FIG. 20 or the oxide layer 270 of FIGS. 21-23 as described above.

It should be noted that the descriptions above for FIG. 20 andcorresponding to FIGS. 21-23, describe the semiconductor 204 of FIG. 20and the semiconductor 260 of FIGS. 21-23 as being of a P-type CZT.However, it should be noted that the rectifying contacts such asillustrated by FIGS. 21-23 with characterizations as shown by the graphs300 and 320 of FIGS. 24 and 25, respectively, may be produced bysemiconductors different than CZT, by N-type semiconductors and bypassivation or oxide layers having the inter-band energy-levels 284,which may have different energies, different density of theenergy-levels, different gradient, and different slope orientation underdifferent voltage biases of the rectifying contacts.

FIG. 26 is a schematic illustration of the radiation detector 350similar to the radiation detector 201 of FIG. 20 with the exception thatthe semiconductor 204 of FIG. 20 is a P-type CZT semiconductor, whilethe semiconductor 205 of FIG. 26 is a N-type CZT semiconductor. Asdescribed above, the anodes 208, according to various embodiments,applied on the passivation oxide layer 206 having the inter-bandenergy-levels 284 serve as rectifying contacts for both P-type andN-type semiconductors. The polarity of the forward bias for the P-typesemiconductor is opposite to the polarity of the forward bias for theN-type semiconductor. From FIG. 22 and the description thereof, itshould be clear that when the semiconductor 260 (the semiconductor 204of FIG. 20) is a P-Type semiconductor, the polarity of the forward biasis characterized by the metal-contact 254 (the anodes 208 of FIG. 20)being negative with respect to the semiconductor 260. Accordingly, theforward bias for the anodes 208 of the detector 350 of FIG. 26 havingthe N-Type CZT semiconductor 205 is characterized by the metal-contact280 being positive with respect to the semiconductor 205.

The rectifying anode-contacts 208 are schematically illustrated by theelectrical diodes 352 shown in broken-lines. It should be appreciatedthat while the diodes 352 are oriented, according to the “conventionalflow notation” according to which the flow is from the anode 208 to thesemiconductor 205 via the layer 206, the “electrons flow notation”,representing the real flow-direction of the electrons is in the oppositedirection from the semiconductor 205 via the passivation layer 206 intothe anode-contact 208. Accordingly, electrons produced by photonsabsorption in the semiconductor 205 drift towards the positive bias ofthe anodes 208 and arrive at the anode-contacts 208 when the contacts208 are in a forward bias allowing the drift electrons to pass from thesemiconductor 205 through the passivation oxide layer 206 into theanodes 208 to be collected by the anodes 208.

FIG. 27 schematically illustrates a side view cross-section of thepixelated radiation-detector 400 similar to the radiation detector 350of FIG. 26 with an additional steering grid 209. The detector 400 isshown along a lateral distance L including two anodes 208, one line ofgrid 209 located between the anodes 208 and two half lines of grid 209(grid lines that are cut in the center) located at the edges of therange L on both sides of the anodes 208. The steering grid 209 includesgrid lines aligned along the centers of the gaps 210 between thepixelated anodes 208 located above the passivation layer 206 formed, bygrowing process, on top of the N-Type CZT semiconductor 207. The linesof the grid 209 and the pixels of the anodes 208 both have the samepitch in various embodiments. The cathode 212 of the detector 400 isnegatively biased to form the electrical field that illustrated by lines211 originated at the cathode 212 and aligned positively toward thebiased anodes 208. The lines 211 of the electrical field between thecathode 212 and the anodes 208 are the electron-trajectories along whichthe electrons generated by the absorption of photons in thesemiconductor 207 drift towards the anodes 208 to be collected by theanodes 208.

In CZT radiation detectors, the electrical charge induced in the anodes208 and thus the electrical signal generated in this anode, depends onthe Depth Of Interaction (DOI) indicating the distance from the locationwhere the photon that generates the electrons in the semiconductor 207is absorbed to the anode 208. To improve the energy resolution of thedetector 400, the sensitivity of the electrical signal at the anodes 208to the value of the DOI may be reduced by using anodes having dimensionsthat are small compared to the thickness d of the detector 400. Smallanodes 208 produce “small pixel effect” according to which, the signalinduced in the anodes 208 is produced mainly in the vicinity of theanodes 208. Due to this effect, the detector 400 having small anodes 208is not sensitive to the DOI and has good energy resolution.

However, small anodes 208 typically have poor electroncollection-efficiency. To improve the electron collection efficiency ofthe anodes 208, the drift of the electrons toward the anodes 208 isenhanced by the steering grid 209 that is biased positively relative tothe cathode 212 but, having a potential (V-ΔV) that is lower by theamount ΔV with respect to the anode 208 having the potential V.Accordingly, while the steering grid 209 improves the drift of electronstoward the anodes 208, these electrons are not collected and escape thecollection of grid 209 by being attracted toward the anodes 208 having apotential higher than the potential of the grid 209.

Thus, in some embodiments, the combination of small anodes with thesteering grid 209 produces the detector 400 with good energy resolutionand high electron collection-efficiency. However, due to the potentialdifference ΔV between the anodes 208 and the grid 209, the detector 400may suffer from high leakage current between the anodes 208 and grid 209when the value for ΔV is large (about 100V) and the distance between theanodes 208 and the grid 209 is short (less than 100 μm). In variousembodiments, the leakage current between the anodes 208 and the steeringgrid 209 is reduced or eliminated by using rectified contacts 208schematically illustrated by electrical diodes 402 shown by broken linesand are similar to the diodes 352 of FIG. 26, i.e. the rectifyinganode-contacts 208 are oriented, according to the “conventional flownotation” according to which the flow is from the anode 208 to thesemiconductor 207 via the layer 206. However, the “electrons flownotation”, representing the real flow-direction of the electrons is inthe opposite direction from the semiconductor 207 via the passivationlayer 206 into the anode-contact 208. Accordingly, electrons produced,by photons absorption in the semiconductor 207, drift toward thepositive bias of the anodes 208 and the grid 209 and arrive at theanode-contacts 208 when the contacts 208 are in a forward bias allowingthe drift electrons to pass from the semiconductor 207 through thepassivation oxide layer 206 into the anodes 208 to be collected by theanodes 208 while escaping the collection by the grid 209.

FIGS. 28-30 illustrate the leakage current between the anodes 208 andthe grid 209 may be reduced by rectifying the anode contacts 208 and thegrid contacts 209. FIG. 28 illustrates an electrical equivalent circuit450 representing the electrical rectifying contacts between the anode208 and the grid 209 of FIG. 27 having potentials V and (V-ΔV),respectively. From the circuit 450 it can be seen that two electricaldiodes 402 are connected in series and aligned head-to-head. This meansthat one of the diodes 402 is in reverse bias and has very highresistance, which ensures that the leakage current between the anodes208 and the steering grid 209 is low. Accordingly, the rectifying anodecontacts 208 and the rectifying grid contacts 209 reduce or eliminatethe leakage current between the anodes 208 and the grid 209 to producedetector, such as the detector 400 of FIG. 27, which in variousembodiments has good energy resolution, high electroncollection-efficiency and low leakage-current between the anodes 208 andgrid 209.

FIG. 29 is a graph 500 showing a Current-Voltage (I-V) curve 501 asmeasured between the anode 208 and the steering grid 209 of the CZTdetector of FIG. 27 or the equivalent electrical circuit 450 of FIG. 28.The measured current is the current that flows between the anode 208 andthe grid 209 via the passivation layer 206 as a function of the voltageapplied between the anode 208 and the grid 209 of FIG. 27 or 28corresponding to the measurement of the current that flows via the twoelectrical diodes 402 of FIG. 28 connected in series and orientedhead-to-head. Since one of the diodes 402 is in a reverse bias, for anybias polarity, the diode 402 is under a blocking condition and has verylow current passing therethrough. This corresponds to high resistance,which is dominant in comparison to the diode 402 that is in forwardbias, under the same bias conditions in which the other diode 402 is inthe blocking state. Accordingly, for any bias polarity, the resistancebetween the anode 208 and the grid 209 is similar to the resistance ofthe diode 402 under reverse bias corresponding to blocking state and lowcurrent.

The values of the measured current that flows between the anode 208 andthe grid 209 in Nano Ampere units [nA] are marked along Y-axis 502 ofthe graph 500 and the values of the measured voltage between the anode208 and the grid 209 in Volts units [V] are marked along X-axis 504 ofthe graph 300.

The negative values of the voltage between the anode 208 and the grid209 appear in the negative part 506 of X-axis of the graph 500. Thisregion includes one diode in a blocking state and corresponds to thesituation illustrated by FIG. 23 in which the MOS contact (the diodes402) is in reverse-bias. The positive values of the voltage between theanode 208 and the grid 209 appear in the positive part 508 of X-axis ofthe graph 500. This region includes one diode in a blocking state andcorresponds to the situation illustrated by FIG. 23 in which one of theMOS contacts (the diodes 402) is in reverse-bias.

From the graph 500, it can be seen that for any bias polarity betweenthe anode 208 and the grid 209 and as described above, the currentbetween the anode 208 and the grid 209 is similar to the current of thediode 402 in a blocking state (see also the region 308 of the graph 300of FIG. 24) and, thus, provides a low leakage current between the anode208 and the grid 209.

FIG. 30 is a graph 550 showing a resistance curve 551 as measured on aN-Type CZT detector between the anode 208 and the grid 209 of FIG. 27 orthe electrical equivalent circuit of FIG. 28. The measured resistance isthe resistance between the anode 208 and the grid 209 of FIG. 27measured as a function of the voltage applied between the anode 208 andthe grid 209 of FIG. 27 or 28 corresponding to the resistance of thediode 402 in a blocking state. The values of the measured resistancebetween the anodes 208 and the grid 209 in Giga-Ohm units [Q] are markedalong Y-axis 552 of the graph 550 and the values of the measured voltagebetween the anode 208 and grid 209 in Volts units [V] are marked alongX-axis 554 of graph 550.

The negative values of the voltage between the anode 208 and the grid209 appear in the negative part 556 of X-axis of the graph 550. Thisregion includes one diode in a blocking state and corresponds to thesituation illustrated by FIG. 23 in which the MOS contact (the diodes402) is in reverse-bias (low current and high resistance). Similarly,the positive values of the voltage between the anode 208 and the grid209 appear in the positive part 558 of X-axis of the graph 550. Thisregion, similar to the negative region, includes one diode in a blockingstate and corresponds to the situation illustrated by FIG. 23 in whichthe MOS contact (the diodes 402) is in reverse-bias.

From the graph 550, it can be seen that for any bias polarity betweenthe anode 208 and grid the 209 and as described above, the resistancebetween the anode 208 and the grid 209 is similar to the resistance ofthe diode 402 in a blocking state and, thus, provides high resistance(low leakage current) between the anode 208 and the grid 209. From theshape of the resistance curve 551 in the graph 550 of FIG. 30, it can beseen that in the bias range between −200V to +300V the curve has adynamic negative resistance. Such dynamic negative resistance is typicalto a tunneling effect via an oxide layer having low density inter-bandenergy levels, such as the passivation oxide layer 206 that has theinter-band energy-levels 284 of FIGS. 21-23, respectively.

FIG. 31 is a flowchart 601 illustrating and describing a method,including the processing steps in the fabrication sequence of adetector, for example, the detector 201 illustrated by FIGS. 14-20 orthe detector 400 of FIG. 27 having pixelated anodes 208 or having theanodes 208 combined together with the steering grid 209 placed in thecenters of the gaps between the anodes 208, respectively.

The fabrication steps illustrated by FIG. 14-20 or 27 (which in theillustrated embodiment include seven steps) correspond to the steps600-612 illustrated by the flowchart 601 as described in more detailabove. In general, and in various embodiments, a gentle polish isperformed at 600 and is followed by the growth of an encapsulation andpassivation oxide layer at 602, by plasma process, on the top of thesurface of the anode side. Deposition of pixelated anode metal contactswith or without a steering grid are applied by evaporation via ashadowing mask, at 604, on top of the encapsulation and passivationlayer, which is grown on the surface of the anode side. The steeringgrid may not be continuous and may include narrow gaps to allow the useof shadowing mask.

A protection layer on the surface of the anodes side is applied at 606followed by a wet or dry etch of the surface on the cathode sideopposite to the anodes side at 608. A deposition of a monolithic metalcontact on the surface of the cathode side is applied at 610 followed bythe removal of the protecting layer from the anodes side at 612.

Accordingly, by practicing various embodiments, a pixelated radiationdetector with rectifying anode contacts may be fabricated with anefficient and simple fabrication process due to a high production yieldachieved. The formation of the grown encapsulation and passivation oxidelayer 206 facilitate the fabrication process and enhance the detectorstabilization, reliability and performances. The gentle non-standardpolishing together with the encapsulation and passivation layer 206produce the gaps 210 having the high resistivity surfaces with aresistivity similar to the resistivity of the bulk of the semiconductor204 resulting in a higher performance radiation detector produced withhigh production yield at relatively low cost.

Variations and modifications are contemplated. For example, although thesemiconductor 204 in various embodiments is described as being a CZTsemiconductor, the semiconductor may be formed from any suitablematerial. Additionally, although the anodes 208 and the cathode 212 aredescribed as made of Indium, the anodes 208 and the cathode 212 may beformed from any type of material, particularly any type of metal.Moreover, although the electrical contacts of the anodes 208 aredescribed as the rectifying electrical contacts, the cathode 212 may beof an Ohmic, rectifying or blocking electrical type of contacts. Also,although the first and second surfaces of the anodes 208 and the cathode212, respectively, of the semiconductor 204 are described as beingpolished simultaneously in the same fabrication step, these surfaces maybe polished at different fabrication steps, which may or may not beconcurrent.

Additionally, although the anodes 208 and cathode 212 are described asbeing produced in different fabrication steps, the anodes 208 andcathode 212 may be formed simultaneously or currently at the samefabrication step. Further, although the grains in the slurry used in thelast polishing steps are described in one embodiment as having a size of0.05 these grains may have any size, such as less than 0.1 μm. Also, thesize of the grains of the slurry of the various polishing steps may haveany size.

Additionally, although the formation of the rectifying anode contacts208 is described as formed by applying reactive metals, such as Indiumor Aluminum, to form, by a doping process of at least partial diffusion,inter-band energy-levels 284 in the passivation oxide layer 206 on whichthese metals are applied, other reactive metals may be used to form theinter-band energy-levels 284 in the passivation oxide layer 206.Additionally, although the formation of the rectifying anode contacts208 is described as formed by applying stiff and or rigid metals, suchas Platinum or Aluminum on the passivation oxide layer 206 to form, bycreating local damage produced by mechanical stress, the inter-bandenergy-levels 284 in the passivation oxide layer 206 on which thesemetals are applied, other stiff and or rigid metals may be used to formthe inter-band energy-levels 284 in the passivation oxide layer 206.

Thus, various embodiments provide methods for fabricating a radiationdetector, such as a pixelated radiation detector, which may include asteering grid, and without chemical etching to remove damaged layers atleast from the surface on the anodes side of semiconductor 204.Accordingly, in various embodiments, a completely dry process with nochemical etching is used on the surface of the semiconductor 204 on theside of the anode contacts 208.

It is to be understood that the above description is intended to beillustrative, and not restrictive. For example, the above-describedembodiments (and/or aspects thereof) may be used in combination witheach other. In addition, many modifications may be made to adapt aparticular situation or material to the teachings of the variousembodiments without departing from their scope. While the dimensions andtypes of materials described herein are intended to define theparameters of the various embodiments, the embodiments are by no meanslimiting and are exemplary embodiments. Many other embodiments will beapparent to those of skill in the art upon reviewing the abovedescription. The scope of the various embodiments should, therefore, bedetermined with reference to the appended claims, along with the fullscope of equivalents to which such claims are entitled. In the appendedclaims, the terms “including” and “in which” are used as theplain-English equivalents of the respective terms “comprising” and“wherein.” Moreover, in the following claims, the terms “first,”“second,” and “third,” etc. are used merely as labels, and are notintended to impose numerical requirements on their objects. Further, thelimitations of the following claims are not written inmeans-plus-function format and are not intended to be interpreted basedon 35 U.S.C. §112, sixth paragraph, unless and until such claimlimitations expressly use the phrase “means for” followed by a statementof function void of further structure.

This written description uses examples to disclose the variousembodiments, including the best mode, and also to enable any personskilled in the art to practice the various embodiments, including makingand using any devices or systems and performing any incorporatedmethods. The patentable scope of the various embodiments is defined bythe claims, and may include other examples that occur to those skilledin the art. Such other examples are intended to be within the scope ofthe claims if the examples have structural elements that do not differfrom the literal language of the claims, or if the examples includeequivalent structural elements with insubstantial differences from theliteral languages of the claims.

What is claimed is:
 1. A method for fabricating a radiation detector,the method comprising: mechanically polishing at least a first surfaceof a semiconductor wafer using a polishing sequence including aplurality of polishing steps, wherein a last polishing step of thepolishing sequence includes polishing with a slurry having a grain sizesmaller than about 0.1 μm to create a polished first surface; growing apassivation oxide layer on a top of the polished first surface to sealand passivate the polished first surface; depositing patterned metalcontacts on a top of the passivation oxide layer having at least onepattern being (i) a pattern of pixelated anodes or (ii) a pattern ofpixelated anodes with grid electrodes having lines of electrodes alignedalong centers of gaps between the anodes; applying a protecting layer onthe patterned deposited metal contacts to protect the metal pattern onthe first surface; etching a second surface of the semiconductor;applying a monolithic cathode electrode on the etched second surface ofthe semiconductor; and removing the protecting layer from the patternedmetal contacts on the first surface, wherein the patterned metalcontacts are formed from one of (i) reactive metals and (ii) stiff-rigidmetals for producing inter-band energy-levels in the passivation oxidelayer.
 2. The method of claim 1, wherein the inter-band energy levelsenhance a tunneling of charge-carriers from and to the semiconductorwafer via the passivation oxide layer for causing the patterned metal tobehave as electrical rectifying contacts, the inter-band energy-levelsformed in the passivation oxide layer by one of (i) diffusion of atleast part of the patterned metal contacts into the passivation oxidelayer to create doping therein (ii) creating local damage in thepassivation oxide layer by producing mechanical stress between thepatterned metal contacts and the passivation oxide layer.
 3. The methodof claim 1, wherein the polishing forms the polished first surfacehaving a resistivity substantially the same as a bulk resistivity of thesemiconductor wafer.
 4. The method of claim 1, wherein the polishing andthe passivation layer that form the polished first surface and cause thefirst surface to have a resistivity substantially the same as a bulkresistivity of the semiconductor wafer.
 5. The method of claim 1,wherein the semiconductor wafer is one of a N-Type semiconductor and aP-Type semiconductor.
 6. The method of claim 1, wherein the gridelectrodes is a steering grid that is biased by a voltage potentiallower than the voltage potential of the anodes.
 7. The method of claim1, wherein the patterned metal is one of Indium, Platinum, Aluminum orNickel.
 8. The method of claim 7, wherein the patterned metal has areactive level to at least partially penetrate into the passivationlayer to create therein the inter-band energy-levels.
 9. The method ofclaim 7, wherein the patterned metal is formed to have a thickness,stiffness and rigidity in amounts that create mechanical stress on thepassivation layer to produce, in the passivation layer, the inter-bandenergy-levels.
 10. The method of claim 1, wherein the etching of thesecond surface produces in the etched regions a semiconductor rich withone of the semiconductor components.
 11. The method of claim 1, whereinthe etching of the second surface is comprises one of a chemical wetetching and an ion-etching.
 12. The method of claim 1, wherein thesemiconductor comprises Cadmium Zinc Telluride (CZT).
 13. The method ofclaim 1, wherein the passivation layer comprises Tellurium Oxide (TeO₂).14. The method of claim 1, wherein the passivation oxide layer is grownon the semiconductor using a plasma process.
 15. The method of claim 14,wherein the plasma process includes ionizing of gas by microwaveradiation.
 16. The method of claim 15, wherein the gas is a mixture ofgases including oxygen.
 17. The method of claim 1, wherein the pixelatedanode electrodes and the cathode electrode are formed from a metal, themetal being at least one of Indium, Gold, Platinum, Nickel or Aluminum.18. The method of claim 1, wherein the patterned metal is applied to thesemiconductor by a processing technique including evaporation via ashadowing mask.
 19. The method of claim 1, wherein the cathode electrodeproduced on the semiconductor is formed from electrical contacts beingone of Ohmic contacts or blocking contacts.
 20. The method of claim 1,wherein the first and second surfaces of the semiconductor are polishedsimultaneously in a same fabrication step.
 21. The method of claim 1,wherein the first and second surfaces of the semiconductor are polishedin a plurality of different fabrication steps.
 22. The method of claim1, wherein a leakage current between the anode electrodes and the gridelectrodes flows along a path including a rectifying contact that isreversely biased and is in a blocking state.
 23. The method of claim 1,wherein the pixelated anode electrodes and the cathode electrode areapplied to the semiconductor simultaneously in a same fabrication step.24. The method of claim 1, wherein the pixelated anode electrodes andthe cathode electrode are applied to the semiconductor in a plurality ofdifferent fabrication steps.
 25. The method claim of claim 1, whereinthe last polishing step includes a slurry having grain size of about0.05 μm.
 26. A method for fabricating an anode side of a radiationdetector, the method comprising: mechanically polishing at least a firstsurface of a semiconductor wafer using a plurality of polishing steps;growing a passivation oxide layer on a top of the polished firstsurface; and forming patterned metal contacts on a top of the of thepassivation oxide layer using a dry process without wet chemicaletching.
 27. The method of claim 26, wherein the mechanically polishingcomprises using, in a last polishing step, a slurry having a grain sizesmaller than about 0.1 μm.
 28. A radiation detector comprising: asemiconductor; a passivation layer on a first surface of thesemiconductor; pixelated anode electrodes on the passivation layer;rectifying anodes producing inter-band energy-levels in the passivationlayer; and a monolithic cathode of a second surface of the semiconductoropposite the first surface.
 29. The radiation detector of claim 28,wherein the pixelated anode electrodes comprise dry etched electrodes.30. The radiation detector of claim 28, further comprising a steeringgrid.
 31. The radiation detector of claim 30, wherein the pixelatedanode electrodes have an electrical potential that is higher than anelectrical potential of the steering grid.